FaraBead Gold Particles GD 0375

 High quality FaraBead® gold-plated particles for microelectronic packaging in electronics manufacturing areprovided by  Nanomicro Tech.

With increasing resolutions and decreasing number of circuit chips or modules in liquid-crystal displays (LCD), the input/output (I/O) density in integrated circuit increases while the size and pitch of the interconnection bumps are becoming very small.   FaraBead® Au particles are electrically conductive and typically dispersed in a binder to form anisotropic conductive adhesive (ACA) materials such as anisotropic conductive film (ACF) or anisotropic conductive paste (ACP) employed in the connection of microelectrodes.  FaraBead® Au conductive particles have outstanding size uniformity, high conductivity, appropriate elasticity and strong adhesion between the metal layer and the resin core. Designed specifically for vertical connection of fine-pitch electrodes, FaraBead® Au conductive particles are used, for example, in the interconnect between the two glass panels in the fabrication of LCD cells.    

Characteristics

u  Monodisperse resin particles as core and metallic gold as shell

u  Broad size selection: 3.0 µm − 10.0 µm (in 0.1 µm increment)

u  Uniform in size and shape, coefficient of variation (CV) ≤ 3.5%

u  Good dispersivity, no overlaps or aggregates

u  Suitable hardness for high conduction reliability

u  Low resistance, high stability under heat and humidity

Optical and SEM micrographs of FaraBead^® Au particles

FaraBead^® Au    

* The K value at 10% deformation is defined by the following equation:

K=(32)∙F∙S-3/2∙R-1/2

wherein F and S represent a load value (kgf) and a compression displacement (mm) at 10% compression deformation of the particle, respectively, and R represents a radius (mm) of the particle.