FaraBead Gold Particles GD 025

FaraBead® Au particles are electrically conductive and typically dispersed in a binder to form anisotropic conductive adhesive (ACA) materials such as anisotropic conductive film (ACF) or anisotropic conductive paste (ACP) employed in the connection of microelectrodes. 

With increasing resolutions and decreasing number of circuit chips or modules in liquid-crystal displays (LCD), the input/output (I/O) density in integrated circuit increases while the size and pitch of the interconnection bumps are becoming very small. Nanomicro Tech provides high quality FaraBead® gold-plated particles for microelectronic packaging in electronics manufacturing. 

 FaraBead® Au conductive particles have outstanding size uniformity, high conductivity, appropriate elasticity and strong adhesion between the metal layer and the resin core. Designed specifically for vertical connection of fine-pitch electrodes, FaraBead® Au conductive particles are used, for example, in the interconnect between the two glass panels in the fabrication of LCD cells.    

Characteristics

u  Monodisperse resin particles as core and metallic gold as shell

u  Broad size selection: 3.0 µm − 10.0 µm (in 0.1 µm increment)

u  Uniform in size and shape, coefficient of variation (CV) ≤ 3.5%

u  Good dispersivity, no overlaps or aggregates

u  Suitable hardness for high conduction reliability

u  Low resistance, high stability under heat and humidity

Optical and SEM micrographs of FaraBead^® Au particles

FaraBead^® Au    

* The K value at 10% deformation is defined by the following equation:

K=(32)∙F∙S-3/2∙R-1/2

wherein F and S represent a load value (kgf) and a compression displacement (mm) at 10% compression deformation of the particle, respectively, and R represents a radius (mm) of the particle.